參數(shù)資料
型號(hào)： 21103
英文描述： AMD-K6 Processor Family Thermal Solutions Application Note AMD-K6 Processor Power Supply Design Application Note
中文描述： 的AMD - K6處理器系列散熱解決方案應(yīng)用指南的AMD - K6處理器電源設(shè)計(jì)應(yīng)用指南
文件頁數(shù)： 59/64頁
文件大?。?/td> 1056K
代理商： 21103
49
21103G/0—February 1999
AMD-K6
Processor Power Supply Design
C8
C1
C5
C7
C14, C15
R1
R2, R4
R3
R5
R7
R14
R8, R15
R6, R10
R9, R11
R12
R13
HS1
HS2
Notes:
1) For the applications where it is desirable not to use the Heatsink, the IRL3103S MOSFET in the TO263 SMT package with
1 inch square of pad area using top and bottom layers of the board as a minimum is required.
2) R13 sets the Vcore, approximately 1% higher to account for the trace resistance drop.
Capacitor, Ceramic
Capacitor, Ceramic
Capacitor, Ceramic
Capacitor, Ceramic
Capacitor, Ceramic
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor (Note 2)
Q1 Heatsink
Q2 Heatsink
0.1
μ
F, SMT 0805 size
150 pF, X7R, SMT 0805 size
220 pF, SMT 0805 size
470 pF, SMT 0805 size
0.01
μ
F, SMT 0805 size
2.21 k
,1%, SMT 0805 size
10
, 5%, SMT 1206 size
Short or 5
, 5%, SMT 1206 size
10 k
, 5%, SMT 0805 size
267
,
1%, SMT 0805 size
180
, 1%, SMT 0805 size
150
, 1%, SMT 0805 size
1 k
, 5%, SMT 0808 size
100
, 5%, SMT 0805 size
100
, 1%, SMT 0805 size
10 k
, 1%, SMT 0805 size
6270
6270
Thermalloy
Thermalloy
Table 18. Unisem US3004 Bill of Materials (continued)
Reference
Description
Part Number
Manufacturer
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參數(shù)描述
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