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參數(shù)資料
| 型號： | 2-5102162-6 |
| 廠商： | Tyco Electronics |
| 元件分類： | 矩形連接器 |
| 英文描述： | AMP–LATCH Pin and Pinless Headers |
| 中文描述： | 插針及無插針針座（AMP–LATCH） |
| 文件頁數(shù)： | 63/96頁 |
| 文件大小： | 3917K |
| 代理商： | 2-5102162-6 |
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150
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
ACTION PIN Press-Fit Posts
AMPMODU Interconnection System
ACTION
PIN
Press-Fit
Posts
5
The Reliable Plated-Through Hole Interconnect
Solderless interconnections have been popular in electrical
and electronic applications with world-wide success for
decades. They provide reliable electrical and mechanical
stability and offer applied-cost savings across the board.
For PC board applications, compliant ACTION PIN posts
provide these features:
■ Large gas-tight contact zone
■ High reliability due to stored energy
■ More resistant to damage to plated-through holes during
installation
■ Especially suited for multilayer PC boards
■ Less costly board manufacturing due to larger hole
tolerances compared to use of solid pins
■ Application can be made by end-user
■ Repairability—contact can be replaced in the same pin
location (two repairs)
■ Installation with no heat cycling of board
■ Permits mass insertion by minimizing forces needed to
insert pins as compared to solid pin press-fit application
■ Significant applied-cost savings in many applications
Since compliant ACTION PIN posts do not have to be
soldered, problems associated with solder are eliminated,
such as:
■
Faulty solder joints
■
Solder fumes; contaminants are deposited on the
contacts
■
Solder spots; short circuits between printed circuits
■
Flux residuals
■
Thermal strain on printed circuit boards and
components
■
Degassing of plated-through holes
Solderless press-fit interconnections using compliant pins
are primarily integrated in, but not limited to, backplanes.
Solderless press-fit interconnections are used in racks,
especially where connectors must be fixed on the solder
side of the PC board and/or component side. In these
applications, the holes for ACTION PIN post connectors are
covered during the soldering process and press-fitting is
performed after soldering.
Other applications for ACTION PIN post interconnections
include PC boards that incorporate components using
surface mount technology (SMT). Here, too, press-fit
interconnections can be applied after soldering, thus
eliminating complications associated with connectors
suitable for surface mounting.
Cross-Section Area of ACTION PIN Press-Fit Post in Printed Circuit
Board Holes
Minimum
Hole Dia.
.037 [0.94]
Maximum
Hole Dia.
.043 [1.09]
Principle of the Compliant ACTION PIN Post
When a compliant ACTION PIN post is inserted into a
plated-through hole, two spring members are compressed,
exerting force against the hole for a gas-tight connection.
The diameter of the hole is smaller than the diagonal size of
the pin (see cross-section illustration below).
The beam characteristics of the pin are designed so that a
plastic, as well as an elastic, deformation takes place during
insertion. The two spring members compress to different
degrees to accommodate hole tolerances. The compliant
pin also reduces strain on the board. With a rigid pin, the
elastic strain energy is stored entirely in the board, leading
to damage of the plated-through holes. With the compliant
ACTION PIN post, the residual force of the elastic
deformation maintains stored energy to produce a tight
contact zone between the pin and the plated-through hole.
This maintains long-term electrical and mechanical
reliability of the interconnection.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 2510-22F | 功能描述:固定電感器 .82uH 1% .24ohm Unshielded SMT Induc RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| 2510-22F TR 750 | 制造商:API Delevan 功能描述:INDUCTOR .82 UH 1% SMD |
| 2510-22G | 功能描述:固定電感器 .82uH 2% .24ohm Unshielded SMT Induc RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| 2510-22G TR 750 | 制造商:API Delevan 功能描述:INDUCTOR .82 UH 2% SMD |
| 2510-22H | 功能描述:固定電感器 .82uH 3% .24ohm Unshielded SMT Induc RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
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