- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄156646 > 1600788-7 (Tyco Electronics) MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System PDF資料下載
參數(shù)資料
| 型號(hào)： | 1600788-7 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 中文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 文件頁數(shù)： | 42/52頁 |
| 文件大?。?/td> | 5010K |
| 代理商： | 1600788-7 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁當(dāng)前第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁
Board-to-Board
Products
56
Catalog 1773096
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 2-10
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-(0)8002-67666
Note: All part numbers are RoHS compliant.
Power Connectors & Interconnection Systems
Z-PACK 2 mm Futurebus+ Power Modules
Recommended PC Board Hole Layout
per IPC-D-300, Type II, Class C
(Component Side)
4.001
12.001
10.00
3 Spaces at
2.00 = 6.00
1.50
+0.101
-0.00
Dia. Typ.
(Drilled Hole)
1
Dimensions apply to solder lead versions only.
15.80
11.83
Vertical Pin Assemblies
with Solder Leads and
Compliant Press-Fit Leads
Material and Finish
Housing — Liquid crystal polymer
Pin Contacts — Phosphor bronze,
mating surface plating conforms to
all testing specified for Telcordia
Uncontrolled Environment, with entire
contact underplated with 0.00127 min.
nickel. See customer drawing for spe-
cific lead plating.
Related Product Data
Current Rating — 5 Amps per contact
Mating Force — 2.4N per contact
max.
Unmating Force — 0.3N per contact
max.
Durability — 250 cycles
Technical Documents
Product Specification
108-1441
Application Specification
114-1075
Instruction Sheets
408-6927, 408-4157, 408-4488
Solder Leads
3 Spaces at
2.00 = 6.00
11.50
17.00
Lead
Length
13.60
Mating
Post Length
(See Chart
Below.)
Rows
A B C D
17.80
11.88
Recommended PC Board Hole Layout
per IPC-D-300, Type II, Class C
(Component Side)
4.001
14.001
10.00
1.50
+0.101
-0.00
Dia. Typ.
(Drilled Hole)
1
Dimensions apply to solder lead versions only.
13.50
13.60
4 Spaces at
2.00 = 8.00
Mating Post
Length (See
chart below)
Solder Leads
3.40
4.25
Rows
A B C D E
Lead Length
4 Spaces at
2.00 = 8.00
Part Numbers
Number of
Mating Post
4.25
3.2
Press-Fit
Housing
Seating
Positions
Lengths
Solder Lead
Shroud
Tooling
.256 [6.50]
5536600-1
5536628-1
5536603-1
8
.285 [7.25]
5536625-1
—
536565-X
58512-1
.315 [8.00]
5536623-1
—
5536620-1
10
.256 [6.50]
—
5536642-1
223041-X
1214224-1
.315 [8.00]
—
5536642-7
4 Row
5 Row
Reference specification 114-1075 for plated through hole requirements.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1600788-8 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600798-1 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600798-2 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600798-3 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600798-4 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1600788-8 | 制造商:TE Connectivity 功能描述:MBXL RCPT HSG ASSY, SQUEEZE TO RELEAASE, - Bulk 制造商:TE CONNECTIVITY 功能描述: |
| 1600798-1 | 制造商:TE Connectivity 功能描述:STR RECEPT ASSY MBXL W/KEYS 6P - Rail/Tube 制造商:TE Connectivity 功能描述:CONN MULTI BEAM XL XLE 6POS |
| 1600798-2 | 制造商:TE Connectivity 功能描述:STR RCPT ASSY MBXL W/KEYS 2ACP - Boxed Product (Development Kits) 制造商:TE CONNECTIVITY 功能描述:STR RCPT ASSY MBXL W/KEYS 2ACP |
| 1600798-3 | 制造商:TE Connectivity 功能描述:STR RECEPT ASSY MBXL W/KEYS 3P - Bulk 制造商:TE Connectivity 功能描述:CONN MULTI BEAM XL XLE 3POS |
| 1600798-4 | 制造商:TE Connectivity 功能描述:STR RECEPT ASSY MBXL W/KEYS 4P - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。