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參數(shù)資料
| 型號(hào)： | 1600606-1 |
| 廠商： | Tyco Electronics |
| 元件分類(lèi)： | 終端 |
| 英文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 中文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 文件頁(yè)數(shù)： | 43/52頁(yè) |
| 文件大?。?/td> | 5010K |
| 代理商： | 1600606-1 |
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Board-to-Board
Products
57
Catalog 1773096
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 2-10
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-(0)8002-67666
Note: All part numbers are RoHS compliant.
Power Connectors & Interconnection Systems
Z-PACK 2 mm Futurebus+ Power Modules (Continued)
Right-Angle
Receptacle Assemblies
with Solder Leads and
Compliant Press-Fit Leads
Material and Finish
Housing — Liquid crystal polymer
Receptacle Contacts — Phosphor
bronze, mating surface plating conforms
to all testing specified for Telcordia
Uncontrolled Environment, with entire
contact underplated with 0.00127 min.
nickel. See customer drawing for spe-
cific lead plating.
Technical Documents
Product Specification
108-1441
Application Specification
114-1075
Instruction Sheets
408-6927
3 Spaces at
2.00 = 6.00 Ref.
11.
3
0
±0.1
3
.56
±0.
3
Ty
p
.
8.8
±0.08
+0.1
0.5
-0
9.50
20.45
2.25 Max.
(Point of Contact)
4.00
3.00 ±0.15
4.00
1.00
12.00 Typ.
3 Spaces at
2.00 = 6.00
1.50
+0.10
-0.00
Dia. Typ.
(Drilled Hole)
2.05
+0.10
-0.00
Dia. Typ.
Drilled Hole
2.00 Typ.
4 Spaces at
2.00 = 8.00 Ref.
6.00
1
3
.3
0
±0.1
3
.56
±0.
3
Ty
p
.
10.8
±0.08
+0.1
0.5
-0
9.50
22.45
2.25 Max.
(Point of Contact)
Recommended PC Board Hole Layout
per IPC-D-300, Type II, Class C
(Component Side)
4.00 Typ.
3.00±0.15
1.00
4.00
5 Spaces at
2.00 = 10.00 Ref.
4 Spaces at
2.00 = 8.00 Ref.
1.50
+0.10
-0.00
Dia. Typ.
(Drilled Hole)
2.05
+0.10
-0.00
Dia. Typ.
Drilled Hole
Recommended PC Board Hole Layout
per IPC-D-300, Type II, Class C
(Component Side)
Part Numbers
Number of
Solder Tail Length
Press-Fit
Seating Tool
Positions
0.107 [2.73]0.139 [3.53]
0.140 [3.56]
8
5536607-1
5536613-1
5536614-1
Industry Standard Flat Rock
10
5223092-1
5223093-1
5536649-1
Industry Standard Flat Rock
4 Row
5 Row
Reference specification 114-1075 for plated through hole requirements.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1600606-2 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600636-1 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600636-2 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600636-6 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 1600636-8 | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1600606-2 | 制造商:TE Connectivity 功能描述:PANEL MT RECPT HSG W/GUIDES P - Boxed Product (Development Kits) 制造商:TE Connectivity 功能描述:CONN ASSY RECEPT SOCKET |
| 1600606-3 | 制造商:TE Connectivity 功能描述:PANEL MT RECPT HSG W/GUIDES P |
| 1600606-4 | 制造商:TE Connectivity 功能描述:PANEL MT RECPT HSG W/GUIDES P - Bulk 制造商:TE CONNECTIVITY 功能描述:PANEL MT RECPT HSG W/GUIDES P |
| 1600606-5 | 制造商:TE Connectivity 功能描述:PANEL MT RECPT HSG W/GUIDES P - Bulk 制造商:TE CONNECTIVITY 功能描述:PANEL MT RECPT HSG W/GUIDES P |
| 1600606-7 | 制造商:TE Connectivity 功能描述:PANEL MT RECPT HSG W/GUIDES P |
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