參數(shù)資料
型號: 1254-10SYGT/S530-E2
廠商: Everlight Electronics Co Ltd
文件頁數(shù): 6/8頁
文件大?。?/td> 282K
描述: LED 3MM ROUND YLW/GRN DIFF
標(biāo)準(zhǔn)包裝: 1,000
顏色:
Millicandela 等級: 320mcd
正向電壓: 2V
電流 - 測試: 20mA
波長 - 主: 573nm
波長 - 峰值: 575nm
視角: 30°
透鏡類型: 透明,有色
透鏡樣式/尺寸: 圓形,帶圓頂,3mm
封裝/外殼: 徑向
高度: 5.00mm
安裝類型: 通孔
包裝: 散裝
DATASHEET
LAMP 
1254-10SYGT/S530-E2
 
 
6 
Copyright ?2010, Everlight All Rights Reserved. Release Date : Jan.09. 2014. Issue No: DLE-0006420_Rev.2
www.everlight.com 
 
Prehead
laminar wave
Fluxing
 
 
 
1.    Lead Forming
 
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
 
Lead forming should be done before soldering.
 
Avoid stressing the LED package during leads forming. The stress to the base may damage the LEDs characteristics or it
may break the LEDs.
 
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
 
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.    Storage
 
The LEDs should be stored at 30?C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
 
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.    Soldering
 
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
 
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300
 Max. (30W Max.)
Preheat temp.
100
 Max. (60 sec Max.)
Soldering time
3 sec Max.
Bath temp. & time
260 Max., 5 sec Max
Distance
3mm Min.(From solder
joint to epoxy bulb)
Distance
3mm   Min.   (From   solder
joint to epoxy bulb)
 
Recommended soldering profile
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
 
Dip and hand soldering should not be done more than one time
 
 
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
 
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
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