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參數(shù)資料
| 型號： | 10075024-F01-02ALF |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 213K |
| 代理商： | 10075024-F01-02ALF |
MINITEK Pin-in-Paste
TECHNICAL DATA
Unshrouded / Stacking:
Shrouded:
DESCRIPTION
Minitek is FCI’s brand for board-to-board and
wire/cable-to-board connectors in 2.00 mm pitch.
The Minitek product range includes PCB Card Connectors,
Shrouded and Unshrouded headers
and IDC/CTW receptacles.
FCI is adding five new series of Minitek Headers
to its product range, dedicated to Pin-in-Paste soldering proces-
ses. This brochure gives additional information
for the correct use of Minitek PIP connectors in the
application process.
Pin-in-Paste
Pin-in-Paste (PiP) technology allows the use of TMT
products in SMT manufacturing processes.
The connectors are automatically or manually placed
on the board, then soldered in the same operation
as the SMT components. Despite this, the mechanical strenght
of the TMT soldering is maintained
– still an important requirement for connectors nowadays in many
industrial or automotive applications.
CONNECTOR DESIGN
In order to achieve optimum soldering results, FCI
launches dedicated Pin-in-Paste connectors in the basics+ pro-
duct range. These connectors are fully adapted
to Pin-in-Paste processing in all aspects, including plastic mate-
rial, housing design, pin length, and packaging.
Plastic material: Minitek PIP headers are moulded
in high temperature thermoplastic and are able
to withstand exposure to 260°C peak temperature
for 30 seconds maximum in a convection, infra-red
or vapour phase reflow oven.
Housing design: Standoffs raise the housing body slightly
above the PCB surface and thus allow the
molten solder paste to flow freely from its printed
position into the board hole and around the pin.
The standoffs are correctly positioned for a good
solder paste deposit around the pin. Please respect the stencil
design guidelines below in order to avoid paste deposit around
the standoffs.
Pin length: The connector lead length beyond the bottom
of the PCB is shorter than for traditional TMT products.
Thus, the risk of pushing out the solder paste when inserting
the pin into the PCB hole is very much limited. The solder
paste
will not stick on the pin tip or even fall off completely, but stays
around the pin for free flow during soldering.
FCI uses a solder tail length of 2 ± 0.2 mm for Minitek Headers
for a standard PCB of 1.6 mm thickness.
Packaging: For combining SMT and TMT components
not only in the soldering process, but also in the assembly
process, FCI proposes a choice of pick-and-place
packaging for PIP connectors.
The most common part numbers are available
in tape-on-reel packaging, all others in tube.
Materials
Housing: high temperature thermoplastic
Colour: black
Flammability rating: UL 94 V-O
Pin: Phosphor bronze
Plating: Gold and tin over 1,27 m nickel
Electrical performance
Current rating: 1A continuous
Insulation resistance: 1000 Mq min.
Dielectric withstanding voltage: 650 V
Mechanical performance Pin retention: 7 N min.
Operating
-55°C to +125°C
temperature range
Processing information
Compatible with IR reflow soldering
processes
RoHS information
This product is RoHS compatible according
to the European Union Directive 2002/95/IEC
Reference information
File no. E66906
File no. LR46923
Product drawing: by 8-digit base
part number
Product specification: DPS-12-011
and GS-12-163
Application specification: TA-895
Reflow profile: TA-842
Materials
Housing: high temperature thermoplastic
Colour: cream
Flammability rating: UL 94 V-O
Pin: Phosphor bronze
Plating: Gold and tin over 1,27 m nickel
Electrical performance
Current rating: 2A continuous
Insulation resistance: 1000 Mq min.
Dielectric withstanding voltage: 650 V
Mechanical performance Pin retention: 7 N min.
Operating
-40°C to +125°C
temperature range
Processing information
Compatible with IR reflow soldering
processes
RoHS information
This product is RoHS compatible according
to the European Union Directive 2002/95/IEC
Reference information
File no. E66906
File no. LR46923
Product drawing: by 8-digit base
part number
Product specification: DPS-12-011
and GS-12-163
Application specification: TA-896
Reflow profile: TA-842
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 10075024-F01-02LF | 功能描述:集管和線殼 MINITEK UNSHRD HDR VERT RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 10075024-F01-03LF | 功能描述:集管和線殼 MINITEK UNSHRD HDR VERT RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 10075024-F01-03PLF | 功能描述:集管和線殼 RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 10075024-F01-04PLF | 功能描述:集管和線殼 RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 10075024-F01-04ULF | 功能描述:集管和線殼 8P VERT HDR UNSHRD .2 MICROMETER AU RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
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