參數(shù)資料
型號: 100-1254-2
廠商: Bluetechnix
文件頁數(shù): 21/32頁
文件大小: 0K
描述: MODULE BF527-C-C-Q50S64F8
標準包裝: 1
模塊/板類型: 核心模塊
CM-BF527_HUM_V2.2.docx
27
9 Dependability
9.1 MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last before
failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take all the
components into account. The PCB and solder connections are excluded from this estimation. For test conditions
we assume an ambient temperature of 30°C of all Core Module components except the Blackfin processor (80°C)
and the memories (70°C). We use the MTBF Calculator from ALD (http://www.aldservice.com/) and use the reliability
prediction MIL-217F2 Part Stress standard. Please get in touch with Bluetechnix (office@bluetechnix.com) if you are
interested in the MTBF result.
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