FEATURES
optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Repetition Rate(duty cycle):0.05%
Volts to BV min.
Typical IR less than 1mA above 10V
High temperature soldering: 250°C/10 seconds at terminals
MECHANICAL DATA
Dimensions in inches and (millimeters)
Case: JEDEC DO214AB. Molded plastic over glass passivated junction
Terminal: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end (cathode) except Bidirectional
Standard Packaging: 16mm tape(EIA STD RS-481)
Weight: 0.007ounce, 0.21gram
Ratings at 25℃ ambient temperature unless otherwise specified.
SYMBOL
VALUE
UNITS
PPPM
Minimum
1500
Watts
IPPM
SEE TABLE 1 Amps
TJ , TSTG
-55 to + 150
℃
Notes :
1.Non-repetitive current pulse , per Fig. 3 and derated above T
A = 25℃ per Fig. 2 .
2.Mounted on 8.0mm
2 Copper Pads to each terminal
3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum.
Certified RoHS Compliant
UL File # E223026
1500 Watt Peak Pulse Power
RATING
IFSM
200
Amps
Operating junction and Storage Temperature Range
Fast response time: typically less than 1.0ps from 0
For surface mounted applications in order to
Peak Forward Surge Current,8.3ms Single Half Sine-Wave
Peak Pulse Power Dissipation on 10/1000s waveform (Note 1,FIG.1)
Superimposed on Rated Load,(JEDEC Method) (Note 3)
Peak Pulse Current of on 10/1000s waveform (Note 1,FIG.3)
MDE Semiconductor, Inc.
78-150 Calle Tampico, Unit 210, La Quinta, CA., USA 92253 Tel : 760-564-8656 Fax : 760-564-2414
1-800-831-4881 Email: sales@mdesemiconductor.com Web: www.mdesemiconductor.com
MAXIMUM RATINGS AND CHARACTERISTICS
DEVICES FOR BIPOLAR APPLICATION
For Bidirectional use Suffix CA for types 1.5SMC6.8CA thru types 1.5SMC550CA
Electrical characteristics apply in both directions
1.5SMC SERIES
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
VOLTAGE - 6.8 TO 550 Volts