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參數(shù)資料
| 型號： | 01591.25MR |
| 元件分類： | 保險絲 |
| 英文描述： | ELECTRIC FUSE, 1.25A, 600VAC, 60A (IR), SURFACE MOUNT |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 170K |
| 代理商： | 01591.25MR |
Introduction to Circuit Protection
Introduction to Circuit Protection
Transientology
106
2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Surface Mount Fuses
159 Series
159 Fuse and Clip Series
Please refer to www.littelfuse.com/series/159.html for current information.
Materials
Fuse Body: Ceramic
Fuse Caps/Terminals:
Silver-plated Brass
Clip Base: Gold-plated
Clip Terminals:
Product Marking
Brand Logo, Current Rating, 'T'
Insulation Resistance
(after opening)
condition A (10,000 ohms, minimum)
Operating
Temperature
-55°C to 125°C with proper rerating
Humidity Test
Solderability
Resistance to
Solvents
types)
Thermal Shock
MIL-STD-202, Method 107G, Test
Mechanical Shock
Condition I (100G’s peak for 6 msecs.)
Vibration
Moisture Resistance
Salt Spray/
Atmosphere
Condition B (48 hours)
Terminal Attachment
MIL-STD-202, Method 211, Test
Condition A, 5 lbs applied to end caps
Product Characteristics
Reflow Condition
Pb – free assembly
Pre Heat
-Temperature Min (T
s(min))
150°C
-Temperature Max (T
s(max))
200°C
-Time (Min to Max) (t
s)
60 – 120 seconds
Average Ramp-up Rate (LiquidusTemp
(T
L) to peak)
T
S(max) to TL - Ramp-up Rate
Reflow
-Temperature (T
L) (Liquidus)
217°C
-Temperature (t
L)
60 – 90 seconds
PeakTemperature (T
P)
250
°C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
Time 25°C to peakTemperature (T
P)
8 minutes max.
Do not exceed
260°C
Soldering Parameters
Packaging
Part Numbering System
Packaging Option
Packaging Specification
Quantity
Quantity & Packaging Code
24mm Tape and Reel
1000
MR
0159 1.25 M R
SERIES
AMP Code
QUANTITY Code
PACKAGING Code
Refer to Electrical
Characteristics table
Example:
0.5 amp product
is 0159 .500 MR
(1.25 amp shown)
Dimensions
3.12
[0.123]
4.80
[0.189]
4.80
[0.1
89]
L 1.25 A T
F
10.90 [0.429]
10.10 [0.398]
13.00
[0.512]
3.88
[0.153]
4.40
[0.173]
4.30
[0.169]
4.90 [0.193]
"A"
"B"
.004
3.
5
0
[0.1
38]
3.1
2
[0.1
23]
4.80
[0.1
89]
4.0
0
[0.1
5
7]
3.00
[0.118]
1.70
[0.067]
Recommended Pad Layout
Time
T
e
mperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25C to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 015-91-2600 | 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid?? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
| 01591-2600 | 制造商:MOLEX 功能描述:CGRID SMT BKWY HDR TIN 60CKT UBE |
| 015-91-2620 | 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
| 01591-2620 | 制造商:MOLEX 功能描述:CGRID SMT BKWY HDR TIN 62CKT UBE |
| 015-91-2640 | 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 64 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
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