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參數(shù)資料
| 型號： | μPG174TA |
| 廠商： | NEC Corp. |
| 英文描述： | L-Band PA Driver Amplifier(L波段PA驅(qū)動器放大器) |
| 中文描述： | L波段功率放大器驅(qū)動放大器（長波段功率放大器驅(qū)動器放大器） |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 66K |
| 代理商： | ΜPG174TA |
Data Sheet P13230EJ2V0DS00
8
μ
PG174TA
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235
°
C or below
Time: 30 seconds or less (at 210
°
C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215
°
C or below
Time: 40 seconds or less (at 200
°
C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260
°
C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300
°
C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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