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參數(shù)資料
| 型號(hào)： | μPG139GV |
| 廠商： | NEC Corp. |
| 英文描述： | L-Band DPDT MMIC Switch(雙刀雙擲開關(guān)) |
| 中文描述： | L波段雙刀雙擲單片開關(guān)（雙刀雙擲開關(guān)） |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大小： | 52K |
| 代理商： | ΜPG139GV |
6
μ
PG139GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Soldering Conditions
Symbol
Infrared Ray Reflow
Peak package’s surface temperature: 235°C or below
Reflow time: 30 seconds or less (at 210°C)
Number of reflow process: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or less (at 200°C)
Number of reflow process: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating Method
Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25°C and relative humidity at 65% or less.
Caution
Do not apply more than a single process at once, except for “partial heating method”.
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