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參數(shù)資料
| 型號： | μPD98408 |
| 廠商： | NEC Corp. |
| 英文描述： | ATM Physical Interface(ATM 物理接口) |
| 中文描述： | ATM物理接口（自動柜員機物理接口） |
| 文件頁數(shù)： | 30/32頁 |
| 文件大?。?/td> | 193K |
| 代理商： | ΜPD98408 |
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30
μ
PD98408
4. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD98408.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done
under different conditions.
Surface-Mount Type
μ
PD98408GD-LML: 208-pin plastic QFP (fine pitch) (28
×
28 mm)
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(36 hours of pre-baking is required at 125
°
C afterward)
IR35-367-2
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before
unpacking.
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(36 hours of pre-baking is required at 125
°
C afterward)
VP15-367-2
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before
unpacking.
Partial heating
method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution
Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
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