參數(shù)資料
型號(hào)： μPD78F4216
廠商： NEC Corp.
英文描述： 8/16 Bit RISC Microcontrollers(8/16位RISC微控制器)
中文描述： 8 / 16位RISC微控制器（8 / 16位的RISC微控制器）
文件頁(yè)數(shù)： 40/52頁(yè)
文件大?。?/td> 384K
代理商： ΜPD78F4216
40
μ
PD78F4216
Preliminary Data Sheet
9. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, consult NEC.
Table 9-1. Soldering Conditions for Surface-mount Type
(1)
μ
PD78F4216GC-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method(s)
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 secs. max. (210
°
C min.),
Number of times: twice max.,
Number of days: 7
Note
(after that, prebaking is necessary at 125
°
C for 10 hours)
<Precaution>
Products other than in heat-resistance trays (such as those packaged in a
magazine, taping, or non-heat-resistance tray) cannot be baked while they are in
their package.
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 secs. max. (200
°
C min.),
Number of times: twice max.,
Number of days: 7
Note
(after that, prebaking is necessary at 125
°
C for 10 hours)
<Precaution>
Products other than in heat-resistance trays (such as those packaged in a
magazine, taping, or non-heat-resistance tray) cannot be baked while they are in
their package.
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 secs. max. (per device side)
—
Note
Number of days in storage after the dry pack has been opened. The storage conditions are at 25
°
C, 65%
RH MAX.
Caution Do not use two or more soldering methods in combination (except partial heating).
(2)
μ
PD78F4216GF-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method(s)
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 secs. max. (210
°
C min.),
Number of times: twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 secs. max. (200
°
C min.),
Number of times: twice max.
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 secs. max.,
Number of times: once,
Preheating temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 secs. max. (per device side)
—
Caution Do not use two or more soldering methods in combination (except partial heating).
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