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APPENDIX C REVISION HISTORY
Edition
Major Revisions from Previous Edition
Applicable Chapters
4th Edition
GK Package (80-pin plastic TQFP, fine pitch, 12 mm
×
12 mm) is added
to
μ
PD784021.
Descriptions regarding
μ
PD784038/784038Y Subseries are added.
Descriptions regarding
μ
PD784046 Subseries are added.
Descriptions regarding
μ
PD784208/784208Y Subseries are added.
A “Note” mark is appended to the RETCS instruction, which indicates that
the
μ
PD784208 and 784208Y Subseries do not have the RETCS instruction.
Throughout
Descriptions regarding flash memory are added.
CHAPTER 8
DEVELOPMENT TOOLS
Descriptions regarding the MX78K4 are added.
CHAPTER 9
SOFTWARE FOR
EMBEDDING
5th Edition
New products (
μ
PD784031/Y) and new package (80-pin plastic QFP
(14 mm square, 1.4 mm thick)) have been added to the
μ
PD784038/Y
Subseries.
Entries related to the new product (
μ
PD784054) of the
μ
PD784046
Subseries have been added.
Entries related to the
μ
PD784208 Subseries have been deleted.
Entries related to the
μ
PD784216/Y Subseries have been added.
Entries related to the new products (
μ
PD784915A, 784916A) of the
μ
PD784915 Subseries have been added.
Entries related to the
μ
PD784908 Subseries have been added.
Entries related to the
μ
PD78F4943 Subseries have been added.
Throughout
Note that there is no RETCS instruction in the
μ
PD764208 and
μ
PD784208Y Subseries has been deleted.
CHAPTER 6
INSTRUCTION SET
The entry, ‘Highest-order/On Highest-order side’ for RETI instructions
has been changed to ‘Highest Priority.’
Note that there is no RETCS instruction in the
μ
PD764208 and
μ
PD784208Y Subseries has been deleted, ‘target’ has been added
to the instruction format, and the entry, ‘Highest-order/On Highest-order
side’ has been changed to ‘Highest Priority.’
‘target’ has been added to the instruction format for RETCSB instructions.
CHAPTER 7
DESCRIPTION OF
INSTRUCTIONS
Entries related to flash memory have been corrected.
CHAPTER 8
DEVELOPMENT TOOLS
(2/3)