參數(shù)資料
型號(hào)： μPD784037
廠商： NEC Corp.
英文描述： 8/16 Bit Single Chip Microcontrollers(8/16位單片微控制器)
中文描述： 8 / 16位單片機(jī)微控制器（8 / 16位單片微控制器）
文件頁(yè)數(shù)： 87/98頁(yè)
文件大?。?/td> 650K
代理商： ΜPD784037
87
μ
PD784035, 784036, 784037, 784038
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD784035,
μ
PD784036,
μ
PD784037, or
μ
PD784038.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual
(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1)
μ
PD784035GC-
×××
-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
μ
PD784036GC-
×××
-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
μ
PD784037GC-
×××
-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
μ
PD784038GC-
×××
-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2)
μ
PD784035GC-
×××
-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
μ
PD784036GC-
×××
-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
μ
PD784037GC-
×××
-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
μ
PD784038GC-
×××
-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
-
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
IR35-00-2
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
-
相關(guān)PDF資料
PDF描述
μPD784038Y 8/16 Bit Single Chip Microcontrollers(8/16 位微控制器)
μPD784046(A) 16 Bit Single Chip Microcontrollers(16 位單片微控制器)
μPD784046 16 Bit Single Chip Microcontrollers(16位單片微控制器)
μPD784044 16 Bit Single Chip Microcontrollers(16位單片微控制器)
μPD784054 16 Bit Single Chip Microcontrollers(16位單片微控制器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PD784054GCA2 制造商:NEC 制造商全稱:NEC 功能描述:16-BIT SINGLE-CHIP MICROCONTROLLER
PD784976A 制造商:NEC 制造商全稱:NEC 功能描述:16-Bit Single-Chip Microcontroller
PD7869 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic
PD78F0134 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers
PD78F0134(A) 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*