參數(shù)資料
型號(hào)： μPD78075B
廠商： NEC Corp.
元件分類： 8位微控制器
英文描述： 8 Bit Single Chip Microcontrollers
中文描述： 8位單片機(jī)微控制器
文件頁(yè)數(shù)： 6/76頁(yè)
文件大小： 568K
代理商： ΜPD78075B
6
μ
PD78074B, 78075B
CONTENTS
1.
PIN CONFIGURATION (Top View)................................................................................................... 7
2.
BLOCK DIAGRAM ........................................................................................................................... 10
3.
PIN FUNCTIONS .............................................................................................................................. 11
3.1
Port Pins................................................................................................................................................... 11
3.2
Non-port Pins .......................................................................................................................................... 13
3.3
Pin I/O Circuits and Recommended Connection of Unused Pins ................................................... 15
4.
MEMORY SPACE............................................................................................................................. 19
5.
PERIPHERAL HARDWARE FUNCTIONS...................................................................................... 20
5.1
Ports.......................................................................................................................................................... 20
5.2
Clock Generator ...................................................................................................................................... 21
5.3
Timer/Event Counter............................................................................................................................... 21
5.4
Clock Output Control Circuit................................................................................................................. 25
5.5
Buzzer Output Control Circuit .............................................................................................................. 25
5.6
A/D Converter .......................................................................................................................................... 26
5.7
D/A Converter .......................................................................................................................................... 26
5.8
Serial Interfaces ...................................................................................................................................... 27
5.9
Real-Time Output Port............................................................................................................................ 29
6.
INTERRUPT FUNCTIONS AND TEST FUNCTIONS ..................................................................... 30
6.1
Interrupt Functions ................................................................................................................................. 30
6.2
Test Functions......................................................................................................................................... 33
7.
EXTERNAL DEVICE EXPANSION FUNCTIONS ........................................................................... 34
8.
STANDBY FUNCTION ..................................................................................................................... 34
9.
RESET FUNCTION........................................................................................................................... 35
10. INSTRUCTION SET.......................................................................................................................... 36
11. ELECTRICAL SPECIFICATIONS.................................................................................................... 38
12. CHARACTERISTIC CURVES (FOR REFERENCE ONLY) ........................................................... 65
13. PACKAGE DRAWINGS ................................................................................................................... 67
14. RECOMMENDED SOLDERING CONDITIONS .............................................................................. 69
APPENDIX A. DEVELOPMENT TOOLS ........................................................................................... 70
APPENDIX B. RELATED DOCUMENTS........................................................................................... 72
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