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參數(shù)資料
| 型號： | μPC8109TB |
| 廠商： | NEC Corp. |
| 英文描述： | Silicon MMIC 2.0 GHz Frequency Up-Converter(2.0 GHz 上變頻單片微波集成電路) |
| 中文描述： | 硅單片2.0 GHz的頻率上轉(zhuǎn)換器（2.0千兆赫上變頻單片微波集成電路） |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 185K |
| 代理商： | ΜPC8109TB |
Data Sheet P12770EJ2V0DS00
21
μ
PC8106TB,
μ
PC8109TB
NOTES ON CORRECT USE
(1)
Observe precutions for handling because of electrostatic sensitive devices.
(2)
Form a ground pattern wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3)
Keep the wiring length of the ground pins as short as possible.
(4)
Connect a bypass capacitor to the V
CC
pin.
(5)
Connect a matching circuit to the RF output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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