參數(shù)資料
型號(hào): VNC2-64L1B-TRAY
廠商: FTDI, Future Technology Devices International Ltd
文件頁數(shù): 80/88頁
文件大?。?/td> 0K
描述: IC USB HOST/DEVICE CTRL 64-LQFP
應(yīng)用說明: Vinculum-II IO Cell Description AppNote
Vinculum-II Debug Interface Description AppNote
Vinculum-II IO Mux Explained AppNote
Vinculum-II PWM Example AppNote
Migrating Vinculum Designs AppNote
標(biāo)準(zhǔn)包裝: 160
系列: Vinculum-II
控制器類型: USB 2.0 控制器
接口: USB,主機(jī)/設(shè)備配置,UART,SPI,PWM,閃存 256K,DMA 4CH
電源電壓: 1.62 V ~ 1.98 V
電流 - 電源: 25mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-LQFP(10x10)
包裝: 托盤
其它名稱: VNC2-64L1A-TRAY
VNC2-64L1A-TRAY-ND
81
Copyright 2009-2011 Future Technology Devices International Limited
Datasheet
Vinculum-II Embedded Dual USB Host Controller IC
Version 1.5
Document No.: FT_000138 Clearance No.: FTDI# 143
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat:
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak
Temperature (tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 11.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 °C
220 +5/-0 °C
≥ 2.5 mm
220 +5/-0 °C
Pb Free (green material) = 260 +5/-0 °C
Table 11.2 Package Reflow Peak Temperature
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VNC2-64Q1B-REEL 功能描述:USB 接口集成電路 Vinculum-II Dual Host/Dev IC QFN-64 RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20