μPD720102 5. RECOMMENDED SOLDERING CONDITIONS The μ" />
參數(shù)資料
型號(hào)： UPD720102GC-YEB-A
廠商： Renesas Electronics America
文件頁數(shù)： 28/38頁
文件大小： 0K
描述： IC HOST CTLR USB2.0 3-PORTS QFP
標(biāo)準(zhǔn)包裝： 100
控制器類型： USB 2.0 控制器
接口： PCI
電源電壓： 3.135 V ~ 3.465 V
工作溫度： -20°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 120-TQFP
供應(yīng)商設(shè)備封裝： 120-TQFP（14x14）
包裝： 托盤
Data Sheet S17998EJ4V0DS
32
μPD720102
5.
RECOMMENDED SOLDERING CONDITIONS
The
μPD720102 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μPD720102GC-YEB-A: 120-pin plastic TQFP (Fine pitch) (14 × 14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR60-107-3
Partial heating method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
–
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
μPD720102F1-CA7-A: 121-pin plastic FBGA (8 × 8)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR60-107-3
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
<R>
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