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參數(shù)資料
| 型號(hào)： | UPD16882GS |
| 廠商： | NEC Corp. |
| 英文描述： | MONOLITHIC CD-ROM/DVD-ROM 3-PHASE SPINDLE MOTOR DRIVER |
| 中文描述： | 整體式CD-ROM/DVD-ROM 3相電機(jī)驅(qū)動(dòng)主軸 |
| 文件頁(yè)數(shù)： | 15/20頁(yè) |
| 文件大?。?/td> | 190K |
| 代理商： | UPD16882GS |
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15
μ
PD16882
Data Sheet S13966EJ1V0DS
RECOMMENDED SOLDERING CONDITIONS
μ
PD16882 should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your NEC sales representative.
Surface Mount Type
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
μ
PD16882GS
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: two times, Exposure limit: Not limited
Note
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
Count: two times, Exposure limit: Not limited
Note
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C Max., Time: 10 sec. Max., Count: once,
Exposure limit: Not limited
Note
WS60-00-1
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max., Exposure limit: not
limited
Note
Note
After opening the dry pack, store it at 25
°
C or less and 65
%
RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
REFERENCE
Quality Grades on NEC semiconductor Devices
Semiconductor Device Mounting Technology Manual
NEC Semiconductor Device Reliability/Quality Control System
Semiconductor Selection Guide
C11531E
C10535E
C12769E
X13769X
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