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Introduction
1.4 Product Family
Samsung ASIC
1-9
STD130
MemoryisbecomingmuchmoredominantandlargermemoryisrequiredforSoC
designs. The STD130 compiled memory supports repairable memories, 64Kb to
1Mb with redundancy. These repairable memories use a row redundancy
schemeandBIRA(Built-In-Redundancy-Analysis)tohelpguaranteehigheryield.
The number of redundant rows varies with memory size.
STD130 compiled memories provide a power down mode to significantly reduce
power during a read or write operation. In addition, a stand-by mode is provided
in which memory contents and outputs are stable but power is greatly reduced.
STD130LP, low-power compiled memories, also use a partial array activation
architecture and a bit-line partition structure to reduce power even more.
A two bank architecture is provided on STD130HD compiled memories, except
dual port synchronous SRAM and specialty memories, to improve performance
and reduce power. In this two bank architecture, only one bank is active while the
other bank is in stand-by mode.
Flexible memory aspect ratios are provided to facilitate floor planning of an SoC
design. In addition, an automated datasheet generator documents memory
configuration, timing, aspect ratio and power consumption. Physical abstract
data, also called phantoms or black boxes, for Silicon Ensemble and Apollo are
generated and provided.
BIST (Built-In-Self-Test) circuitry is provided for most STD130 compiled
memories. BIST circuits are designed to detect a set of fault types that impact the
functionality of the memory. The BIST circuitry is generated by a soft macro
based BIST generator. The BIST generator generates both an individual BIST
netlist for each memory and a shared BIST netlist for all memories used in a
design. However, when several memories are used in a design, it is better to
generate a shared BIST netlist to eliminate redundancy in the BIST circuitry over
generating BIST circuits for each memory.