參數(shù)資料
型號(hào)： SSD1815Z
廠商： Electronic Theatre Controls, Inc.
英文描述： SEMICONDUCTOR TECHNICAL DATA
中文描述： 半導(dǎo)體技術(shù)數(shù)據(jù)
文件頁(yè)數(shù)： 4/35頁(yè)
文件大?。?/td> 856K
代理商： SSD1815Z
SSD1815
4
REV 1.5
03/2000
S OLOMON
Table 1 - SSD1815Z Die Pad Coordinates
PAD #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Die Size:
Bump Size:
Pad #
1 - 12
13 - 103
104 - 115
NAME
ROW53
ROW54
ROW55
ROW56
ROW57
ROW58
ROW59
ROW60
ROW61
ROW62
ROW63
ICONS
NC
MSTAT
M
CL
/DOF
VSS
/CS1
CS2
VDD
/RES
D/C
VSS
R/W
E/RD
VDD
D 0
D 1
D 2
D 3
D 4
D 5
D 6
D 7
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS1
VSS1
VSS1
VSS1
VEE
VEE
VEE
VEE
C3N
C3N
C3N
C3N
C1P
C1P
C1P
C1N
C1N
C1N
10.977mm
X
Y
PAD #
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
NAME
C2N
C2N
C2N
C2N
C2P
C2P
C2P
VSS
VSS
VFS
VFS
VDD
VDD
VL2
VL2
VL3
VL3
VL3
VL4
VL4
VL4
VL5
VL5
VL6
VL6
VL6
VF
VF
VDD
VDD
NC
NC
VDD
M/S
CLS
VSS
C68/80
P/S
VDD
/HPM
VSS
IRS
VDD
ROW31
ROW30
ROW29
ROW28
ROW27
ROW26
ROW25
ROW24
ROW23
ROW22
ROW21
ROW20
X
Y
PAD #
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
NAME
ROW19
ROW18
ROW17
ROW16
ROW15
ROW14
ROW13
ROW12
ROW11
ROW10
ROW9
ROW8
ROW7
ROW6
ROW5
ROW4
ROW3
ROW2
ROW1
ROW0
ICONS
X
Y
-4958.45
-4882.15
-4805.85
-4729.55
-4653.25
-4576.95
-4500.65
-4424.35
-4348.05
-4271.75
-4195.45
-4119.15
-4000.50
-3911.60
-3822.70
-3733.80
-3644.90
-3556.00
-3467.10
-3378.20
-3289.30
-3200.40
-3111.50
-3022.60
-2933.70
-2844.80
-2755.90
-2667.00
-2578.10
-2489.20
-2400.30
-2311.40
-2222.50
-2133.60
-2044.70
-1955.80
-1866.90
-1778.00
-1689.10
-1600.20
-1511.30
-1422.40
-1333.50
-1244.60
-1155.70
-1066.80
-977.90
-889.00
-800.10
-711.20
-622.30
-533.40
-444.50
-355.60
-266.70
-177.80
-88.90
0.00
88.90
177.80
X
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
1.912mm
266.70
355.60
444.50
533.40
622.30
711.20
800.10
889.00
977.90
1066.80
1155.70
1244.60
1333.50
1422.40
1511.30
1600.20
1689.10
1778.00
1866.90
1955.80
2044.70
2133.60
2222.50
2311.40
2400.30
2489.20
2578.10
2667.00
2755.90
2844.80
2933.70
3022.60
3111.50
3200.40
3289.30
3378.20
3467.10
3556.00
3644.90
3733.80
3822.70
3911.60
4000.50
4119.15
4195.45
4271.75
4348.05
4424.35
4500.65
4576.95
4653.25
4729.55
4805.85
4882.15
4958.45
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-771.93
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
-751.98
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
5285.18
-768.78
-692.48
-616.18
-539.88
-463.58
-387.28
-310.98
-234.68
-158.38
-82.08
-5.78
70.53
146.83
223.13
299.43
375.73
452.03
528.33
604.63
680.93
757.23
X [um]
43.5
61.7
43.5
Y [um]
101.6
61.7
101.6
Pad #
116 - 136
X [um]
101.6
Y [um]
43.5
Pad #
137 - 268
X [um]
43.5
Y [um]
101.6
Pad #
269 - 289
X [um]
101.6
Y [um]
43.5
x
Y
(0,0)
PIN 1
PIN115
PIN137
PIN268
Gold bump size tolerance: +/-1.5um.
Die Size: 10.977mm X 1.912mm
Bump Height:
- nominal: 18um
- tolerance:<4um (within die)
<6um (within wafer)
<8um (within lot)
Unit in um unless otherwise specified.
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