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參數資料
| 型號： | SSC-YG104-IC1 |
| 廠商： | Seoul Semicondutctor Inc. |
| 英文描述： | CHIP LED DEVICE |
| 中文描述： | 芯片發(fā)光器件 |
| 文件頁數： | 4/7頁 |
| 文件大小： | 325K |
| 代理商： | SSC-YG104-IC1 |
5. Soldering Profile
(1) Reflow Soldering Conditions / Profile
Preliminary heating to be at 150
℃
max. for 2 minutes max.
Soldering heat to be at 220
℃
max. for 5 seconds max.
0
60 to 120 sec.
5sec. max
L
220
150
120
~
°C
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
Operation heating
(2) Reflow Soldering Conditions /Lead-Free Solder
Preliminary heating to be at 150
℃
max. for 2 minutes max.
Soldering heat to be at 255
℃
(+5/-0)
℃
max. for 5 seconds max.
60 to 120 sec.
0
10 to 20 sec.
(+5)
150
120
L
Pre-heating
~
Temperature
rise: 5°C/sec.
°C
Cooling:
-5°C/sec.
Operation heating
(3) Hand Soldering conditions
Not more than 3 seconds @MAX280
℃
, under Soldering iron.
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 4/7 -
SSC-YG104-IC1
SSC-QP-0401-06(REV.0)
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
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| SSC-YGURHT811 | 制造商:SEOUL 制造商全稱:Seoul Semiconductor 功能描述:TOP LED DEVICE |
| SSC-Z16B | 制造商:SEOUL 制造商全稱:Seoul Semiconductor 功能描述:CHIP LED DEVICE |
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