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參數(shù)資料
| 型號： | SA58632BS |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 2 x 2.2 W BTL audio amplifier |
| 封裝： | SA58632BS<SOT910-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT910-1.html<1<Always Pb-free,; |
| 文件頁數(shù)： | 3/28頁 |
| 文件大?。?/td> | 283K |
| 代理商： | SA58632BS |
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SA58632_2
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 4 March 2010
11 of 28
NXP Semiconductors
SA58632
2
× 2.2 W BTL audio amplifier
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the
configuration and size of the heat spreader on the application demo board. Data may not
be comparable between different semiconductors manufacturers because the application
demo boards and test methods are not standardized. Also, the thermal performance of
packages for a specific application may be different than presented here, because of the
configuration of the copper heat spreader of the application boards may be significantly
different.
NXP Semiconductors uses FR-4 type application boards with 1 ounce copper traces with
solder coating.
The demo board (see Figure 23) has a 1 ounce copper heat spreader that runs under the
IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20
package. The heat spreader is symmetrical and provides a heat spreader on both top and
bottom of the PCB. The heat spreader on top and bottom side of the demo board is
connected through 2 mm diameter plated through holes. Directly under the DAP (Die
Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total
top and bottom heat spreader area is 64.5 mm2 (10 in2).
The junction to ambient thermal resistance, Rth(j-a) = 22 K/W for the HVQFN20 package
when the exposed die attach paddle is soldered to 5 square inch area of 1 ounce copper
heat spreader on the demo PCB. The maximum sine wave power dissipation for
(1)
(2)
The power dissipation versus ambient temperature curve (Figure 10) shows the power
derating profiles with ambient temperature for three sizes of heat spreaders. For a more
modest heat spreader using 5 square inch area on the top or bottom side of the PCB, the
Rth(j-a) is 31 K/W. When the package is not soldered to a heat spreader, the Rth(j-a)
increases to 60 K/W.
150
25
–
22
---------------------
5.7 W
=
150
60
–
22
---------------------
4.1 W
=
相關(guān)PDF資料 |
PDF描述 |
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| SA58635UK | 2 x 25 mW class-G stereo headphone driver with I2C-bus volume control |
| SA58637BS | 2 x 2.2 W BTL audio amplifier |
| SA58670ABS | 2.1 W-channel stereo class-D audio amplifier |
| SA58670BS | 2.1 W-channel stereo class-D audio amplifier |
| SA58672TK | 3.0 W mono class-D audio amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58632BS,118 | 功能描述:音頻放大器 2X2.2W BTL PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58632BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
| SA58632BS-T | 功能描述:音頻放大器 2X2.2W BTL PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58635UK,027 | 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58637 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 2.2 W BTL audio amplifier |
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