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參數(shù)資料
| 型號(hào)： | S72NS128RD0AHBL00 |
| 廠商： | SPANSION LLC |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA133 |
| 封裝： | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 |
| 文件頁(yè)數(shù)： | 13/13頁(yè) |
| 文件大小： | 619K |
| 代理商： | S72NS128RD0AHBL00 |
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May 10, 2010 S72NS-R_00_07
S72NS-R Based MCPs
9
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
6.
Physical Dimensions
6.1
RLB133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 mm
3627 \ 16-039.63 \ 8.21.7
PACKAGE
RLB 133
JEDEC
N/A
D x E
8.0 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.80
0.90
1.00
OVERALL THICKNESS
A1
0.18
0.23
0.28
BALL HEIGHT
A2
0.62
0.68
0.74
BODY THICKNESS
D
7.90
8.00
8.10
BODY SIZE
E
7.90
8.00
8.10
BODY SIZE
D1
6.50 BSC.
BALL FOOTPRINT
E1
6.50 BSC.
BALL FOOTPRINT
MD
14
ROW MATRIX SIZE D DIRECTION
ME
14
ROW MATRIX SIZE E DIRECTION
N
133
TOTAL BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
e
0.50 BSC.
BALL PITCH
SD / SE
0.25 BSC.
SOLDER BALL PLACEMENT
D5-D11, E4-E11, F4-F11
DEPOPULATED SOLDER BALLS
G4-G11, H4-H11, J4-J11
K4-K11, L4-L11
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
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