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參數(shù)資料
| 型號： | MPXV5004GVP |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 元件分類： | 壓力傳感器 |
| 英文描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 中文描述： | 集成硅壓力傳感器的片上信號空調(diào)，溫度補償和校準 |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 267K |
| 代理商： | MPXV5004GVP |
MPXV5004G SERIES
3
Sensor Device Data
Freescale Semiconductor
ON--CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear--stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure2illustratesthegaugeconfigurationinthebasicchip
carrier(Case482).Afluorosiliconegelisolatesthediesurface
andwirebondsfromtheenvironment,whileallowingthepres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV5004G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
thandryair,mayhaveadverseeffectsonsensorperformance
and long--term reliability. Internal reliability and qualification
testfordryair,andothermedia,areavailablefromthefactory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for in-
terfacing the output of the MPXV5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over a temperature range of 10
°
C to
60
°
C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 2. Cross--Sectional Diagram (Not to Scale)
1.0
m
F
IPS
470 pF
OUTPUT
Vs
+
5 V
0.01
m
F
GND
Vout
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL SENSING
ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE
Figure 4. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE
5.0
4.0
3.0
2.0
O
TRANSFER FUNCTION:
V
out
= V
S
*[(0.2*P) + 0.2]
±
1.5% V
FSS
V
S
= 5.0 V
±
0.25 Vdc
TEMP = 10 to 60
°
C
1.0
MIN
TYPICAL
2 kPa
200 mm H
2
O
(See Note 5 in Operating Characteristics)
4 kPa
400 mm H
2
O
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXV5010 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5010D | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5010DP | 功能描述:板上安裝壓力/力傳感器 SOP DUAL PORT RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV5010DP | 制造商:Freescale Semiconductor 功能描述:IC PRESSURE SENSOR ((NW)) |
| MPXV5010G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
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