參數(shù)資料
型號： MPC885
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Hardware Specifications
中文描述： 硬件規(guī)格
文件頁數(shù)： 19/92頁
文件大?。?/td> 1499K
代理商： MPC885
MPC885/MPC880 Hardware Specifications, Rev. 3
19
Freescale Semiconductor
Bus Signal Timing
B27
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25
×
B1 – 2.00)
35.90
—
29.30
—
16.90
—
13.60
—
ns
B27a
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50
×
B1 – 2.00)
43.50
—
35.50
—
20.70
—
16.75
—
ns
B28
CLKOUT rising edge to WE(0:3) negated
GPCM write access CSNT = 0
(MAX = 0.00
×
B1 + 9.00)
—
9.00
—
9.00
—
9.00
—
9.00
ns
B28a
CLKOUT falling edge to WE(0:3) negated
GPCM write access TRLX = 0, CSNT = 1,
EBDF = 0 (MAX = 0.25
×
B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
9.93
ns
B28b
CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1
ACS = 10 or ACS = 11, EBDF = 0
(MAX = 0.25
×
B1 + 6.80)
—
14.30
—
13.00
—
10.50
—
9.93
ns
B28c
CLKOUT falling edge to WE(0:3) negated
GPCM write access TRLX = 0, CSNT = 1
write access TRLX = 0, CSNT = 1,
EBDF = 1 (MAX = 0.375
×
B1 + 6.6)
10.90 18.00 10.90 18.00
5.20
12.30
4.69
11.29
ns
B28d
CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1,
ACS = 10, or ACS = 11, EBDF = 1
(MAX = 0.375
×
B1 + 6.6)
—
18.00
—
18.00
—
12.30
—
11.30
ns
B29
WE(0:3) negated to D(0:31) High-Z GPCM
write access, CSNT = 0, EBDF = 0
(MIN = 0.25
×
B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B29a
WE(0:3) negated to D(0:31) High-Z GPCM
write access, TRLX = 0, CSNT = 1,
EBDF = 0 (MIN = 0.50
×
B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B29b
CS negated to D(0:31) High-Z GPCM write
access, ACS = 00, TRLX = 0 & CSNT = 0
(MIN = 0.25
×
B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B29c
CS negated to D(0:31) High-Z GPCM write
access, TRLX = 0, CSNT = 1, ACS = 10,
or ACS = 11 EBDF = 0
(MIN = 0.50
×
B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B29d
WE(0:3) negated to D(0:31) High-Z GPCM
write access, TRLX = 1, CSNT = 1,
EBDF = 0 (MIN = 1.50
×
B1 – 2.00)
43.50
—
35.50
—
20.70
—
16.75
—
ns
B29e
CS negated to D(0:31) High-Z GPCM write
access, TRLX = 1, CSNT = 1, ACS = 10,
or ACS = 11 EBDF = 0
(MIN = 1.50
×
B1 – 2.00)
43.50
—
35.50
—
20.70
—
16.75
—
ns
Table 9. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
66 MHz
80 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
相關(guān)PDF資料
PDF描述
MPC885ZP80 Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:12; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket
MPC885ZP66 Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:41; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:22-41
MPC885CZP66 PT 55C 55#20 PIN RECP
MPC885ZP133 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
MPC885CZP133 Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC885ADS 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC885ADSE 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC885CVR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC885CVR133 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 133MHZ 357-PBGA
MPC885CVR66 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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