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參數(shù)資料
| 型號： | MPC885 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Hardware Specifications |
| 中文描述： | 硬件規(guī)格 |
| 文件頁數(shù)： | 10/92頁 |
| 文件大?。?/td> | 1499K |
| 代理商： | MPC885 |
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MPC885/MPC880 Hardware Specifications, Rev. 3
10
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
Table 4
shows the thermal characteristics for the MPC885/880.
5
Power Dissipation
Table 5
provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are equal, and
2:1, where CPU frequency is twice bus speed.
Table 4. MPC885/880 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3
Per JEDEC JESD51-6 with the board horizontal
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
Single-layer board (1s)
R
θ
JA 2
R
θ
JMA 3
R
θ
JMA3
R
θ
JMA3
37
°C/W
Four-layer board (2s2p)
25
Airflow (200 ft/min)
Single-layer board (1s)
30
Four-layer board (2s2p)
22
Junction-to-board
4
R
θ
JB
17
Junction-to-case
5
R
θ
JC
10
Junction-to-package top
6
Natural convection
Ψ
JT
2
Airflow (200 ft/min)
Ψ
JT
2
Table 5. Power Dissipation (P
D
)
Die Revision
Bus
Mode
CPU
Frequency
Typical
1
1
Typical power dissipation at V
DDL
= V
DDSYN
= 1.8 V, and V
DDH
is at 3.3 V.
Maximum
2
Unit
0
1:1
66 MHz
310
390
mW
80 MHz
350
430
mW
2:1
133 MHz
430
495
mW
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| MPC885ADS | 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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| MPC885CVR133 | 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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