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參數(shù)資料
| 型號： | MPC7457 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 60/68頁 |
| 文件大?。?/td> | 1755K |
| 代理商： | MPC7457 |
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MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
60
Freescale Semiconductor
System Design Information
temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink
attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as system-level
designs.
For system thermal modeling, the MPC7447 and MPC7457 thermal model is shown in
Figure 28
. Four volumes will
be used to represent this device. Two of the volumes, solder ball, and air and substrate, are modeled using the
package outline size of the package. The other two, die, and bump and underfill, have the same size as the die. The
silicon die should be modeled 9.64
×
11.0
×
0.74 mm with the heat source applied as a uniform source at the bottom
of the volume. The bump and underfill layer is modeled as 9.64
×
11.0
×
0.69 mm (or as a collapsed volume) with
orthotropic material properties: 0.6 W/(m K) in the xy-plane and 2 W/(m K) in the direction of the z-axis. The
substrate volume is 25
×
25
×
1.2 mm (MPC7447) or 29
×
29
×
1.2 mm (MPC7457), and this volume has
18 W/(m K) isotropic conductivity. The solder ball and air layer is modeled with the same horizontal dimensions
as the substrate and is 0.9 mm thick. It can also be modeled as a collapsed volume using orthotropic material
properties: 0.034 W/(m K) in the xy-plane direction and 3.8 W/(m K) in the direction of the z-axis.
Figure 30. Recommended Thermal Model of MPC7447 and MPC7457
Bump and Underfill
Die
Substrate
Solder and Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Bump and Underfill
k
x
0.6
W/(m K)
k
y
0.6
k
z
2
Substrate
k
18
Solder Ball and Air
k
x
0.034
k
y
0.034
k
z
3.8
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC7457EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC745BPX300LE | 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BPX350LE | 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT300LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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