參數(shù)資料
型號(hào)： MPC5534
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Microcontroller
中文描述： 微控制器
文件頁(yè)數(shù)： 8/50頁(yè)
文件大?。?/td> 1148K
代理商： MPC5534
MPC5534 Microcontroller Data Sheet, Rev. 0
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
8
where:
T
T
= thermocouple temperature on top of the package (
o
C)
Ψ
JT
= thermal characterization parameter (
o
C/W)
P
D
= power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at
http://www.jedec.org
.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal
Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego,
1999, pp. 212–220.
3.3
Package
The MPC5534 is available in packaged form. Package options are listed in
Section 2, “Ordering
Information
.”
Refer to
Section 4, “Mechanicals,”
for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications
1
Num
Characteristic
Min. Value
Typ. Value
Max. Value
Unit
1
Scan Range
0.15
—
1000
MHz
2
Operating Frequency
—
—
80
MHz
3
V
DD
Operating Voltages
—
1.5
—
V
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