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參數(shù)資料
| 型號(hào)： | MCM63R836 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | MCM63R836 |
| 中文描述： | MCM63R836 |
| 文件頁(yè)數(shù)： | 20/21頁(yè) |
| 文件大?。?/td> | 363K |
| 代理商： | MCM63R836 |
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MCM63R836
MCM63R918
20
MOTOROLA FAST SRAM
63R836
63R918
MCM
XX
X
X
Motorola Memory Prefix
Part Number
Full Part Numbers — MCM63R836FC3.0
MCM63R918FC3.0
MCM63R918FC3.3
MCM63R918FC3.7
MCM63R918FC4.0
MCM63R836FC3.0R
MCM63R836FC3.3R
MCM63R836FC3.7R
MCM63R836FC4.0R
MCM63R918FC3.0R
MCM63R918FC3.3R
MCM63R918FC3.7R
MCM63R918FC4.0R
MCM63R836FC3.3
MCM63R836FC3.7
MCM63R836FC4.0
R = Tape and Reel, Blank = Tray
Package (FC = Flipped Chip PBGA)
Speed (3.0= 3.0 ns, 3.3 = 3.3 ns,
3.7 = 3.7 ns, 4.0 = 4.0 ns)
ORDERING INFORMATION
(Order by Full Part Number)
FC PACKAGE
7 X 17 BUMP PBGA
CASE 999D–01
PACKAGE DIMENSIONS
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
119X
BOTTOM VIEW
D
0.2
7
6
5
4
3
2
1
b
0.15
A
E
E2
D2
C
B
e
0.3
A B C
E3
D3
INDEX
5
4X
TOP VIEW
16X
M
M
e
6X
E1
D1
3
A
SEATING
PLANE
SIDE VIEW
A1
A2
A3
A4
0.2 A
0.35 A
0.25 A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M,1992.
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUM SOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM
PLANE A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. AN AI INDEX MARK WILL BE LOCATED IN THIS
AREA.
6. D2 AND E2 DEFINE THE AREA OCCUPIED BY
THE DIE. D3 AND E3 ARE THE MINIMUM
CLEARANCE FROM THE PACKAGE EDGE TO THE
CHIP CAPACITORS.
7. CAPACITORS MAY NOT BE PRESENT ON ALL
DEVICES.
8. CAUTION MUST BE TAKEN NOT TO SHORT
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
DIM
A
A1
A2
A3
A4
D
D1
D2
D3
E
E1
E2
E3
b
e
MIN
–––
0.50
1.75
0.80
0.92
22.00 BSC
20.32 BSC
12.10
1.10
14.00 BSC
7.62 BSC
7.26
1.10
0.60
1.27 BSC
MAX
2.77
0.70
2.07
0.92
1.15
MILLIMETERS
12.40
7.46
0.90
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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| MCN51-30S3-DS | 16 Characters x 2 Lines, 5x7 Dot Matrix Character and Cursor |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCM63R836A | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8M Late Write HSTL |
| MCM63R836FC3.0 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCM63R836 |
| MCM63R836FC3.0R | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCM63R836 |
| MCM63R836FC3.3 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCM63R836 |
| MCM63R836FC3.3R | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCM63R836 |
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