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參數(shù)資料
| 型號： | MAX4950ACTX+T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Dual PCI Express Equalizer/Redriver; Package: TQFN;36 pin;37 mm² ; Temperature: 0°C to +70°C |
| 中文描述： | BUF OR INV BASED PRPHL DRVR, QCC36 |
| 封裝： | 6 X 6 MM, TQFN-36 |
| 文件頁數(shù)： | 2/10頁 |
| 文件大小： | 531K |
| 代理商： | MAX4950ACTX+T |
MAX4950A
Dual PCI Express Equalizer/Redriver
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2009 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
Applications Information
Layout
Circuit-board layout and design can significantly affect
the performance of the MAX4950A. Use good high-fre-
quency design techniques, including minimizing
ground inductance and using controlled-impedance
transmission lines on data signals. It is recommended
to run receive and transmit on different layers to mini-
mize crosstalk and to place power-supply decoupling
capacitors as close as possible to VCC. Always con-
nect VCC to a power plane.
Exposed Pad Package
The exposed-pad, 36-pin, TQFN package incorporates
features that provide a very low thermal resistance path
for heat removal from the IC. The exposed pad on the
MAX4950A must be soldered to the circuit-board
ground plane for proper thermal performance. For more
information on exposed-pad packages, refer to Maxim
Application Note HFAN-08.1:
Thermal Considerations of
QFN and Other Exposed-Paddle Packages.
Power-Supply Sequencing
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings
may cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all devices. Always apply GND then VCC before apply-
ing signals, especially if the signal is not current limited.
Chip Information
PROCESS: BiCMOS
EN
O_AMPB
O_AMPA
QUIESCENT POWER
SUPPLY CURRENT
(typ) (mA)
QUIESCENT POWER
SUPPLY CURRENT
(max) (mA)
QUIESCENT POWER
DISSIPATION
(3.3V, typ) (mW)
QUIESCENT POWER
DISSIPATION
(3.6V, max) (mW)
0
60
75
198
270
0
1
55
68
182
243
0
1
0
55
68
182
243
0
1
50
60
165
216
1
0
130
165
429
594
1
0
1
125
157
413
565
1
0
125
157
413
565
1
120
150
396
540
Table 5. Quiescent Power Dissipation with Equalization and Deemphasis
PCIe
Tx
Rx
NORTHBRIDGE
PCIe X1
CONNECTOR
0.5m TO 2m CABLE
MAX4950A
Figure 3. Typical Application Circuit—MAX4950A Used as X1
Lane Cable Driver
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
36 TQFN
T3666+2
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