參數(shù)資料
型號(hào)： LM4810MAX/NOPB
廠商： NATIONAL SEMICONDUCTOR CORP
元件分類： 音頻／視頻放大
英文描述： 0.105 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8
封裝： SOIC-8
文件頁(yè)數(shù)： 3/20頁(yè)
文件大?。?/td> 968K
代理商： LM4810MAX/NOPB
Typical Performance Characteristics (Continued)
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
20008938
20008944
Application Information
MICRO-POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4810’s shutdown function. Activate micro-power shut-
down by applying a logic high voltage to the SHUTDOWN
pin. The logic threshold is typically V
DD/2. When active, the
LM4810’s micro-power shutdown feature turns off the ampli-
fier’s bias circuitry, reducing the supply current. The low
0.4A typical shutdown current is achieved by applying a
voltage that is as near as V
DD as possible to the SHUT-
DOWN pin. A voltage that is less than V
DD may increase the
shutdown current.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a
microprocessor, or a microcontroller. When using a switch,
connect an external 100k
pull-up resistor between the
SHUTDOWN pin and V
DD. Connect the switch between the
SHUTDOWN pin and GND. Select normal amplifier opera-
tion by closing the switch. Opening the switch connects the
SHUTDOWN pin to V
DD through the pull-up resistor, activat-
ing micro-power shutdown. The switch and resistor guaran-
tee that the SHUTDOWN pin will not float. This prevents
unwanted state changes. In a system with a microprocessor
or a microcontroller, use a digital output to apply the control
voltage to the SHUTDOWN pin. Driving the SHUTDOWN pin
with active circuitry eliminates the pull-up resistor.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The LM4810’s exposed-Dap (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
However, since the LM4810 is designed for headphone ap-
plications, connecting a copper plane to the DAP’s PCB
copper pad is not required. The LM4810’s Power Dissipation
vs Output Power Curve in the Typical Performance Char-
acteristics shows that the maximum power dissipated is just
45mW per amplifier with a 5V power supply and a 32
load.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LD (LLP) package is
available from National Semiconductor’s Package Engineer-
ing Group under application note AN1187.
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 1 states the maximum power
dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
P
DMAX =(VDD)
2 /(2
π2R
L)
(1)
Since the LM4810 has two operational amplifiers in one
package, the maximum internal power dissipation point is
twice that of the number which results from Equation 1. Even
with the large internal power dissipation, the LM4810 does
not require heat sinking over a large range of ambient tem-
perature. From Equation 1, assuming a 5V power supply and
a32
load, the maximum power dissipation point is 40mW
per amplifier. Thus the maximum package dissipation point
is 80mW. The maximum power dissipation point obtained
must not be greater than the power dissipation that results
from Equation 2:
P
DMAX =(TJMAX TA)/
θ
JA
(2)
For package MUA08A,
θ
JA = 210C/W. TJMAX = 150C for
the LM4810. Depending on the ambient temperature, T
A,of
the system surroundings, Equation 2 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 1 is greater than that of
Equation 2, then either the supply voltage must be de-
LM4810
www.national.com
11
相關(guān)PDF資料
PDF描述
LM4810LDX/NOPB 0.105 W, 2 CHANNEL, AUDIO AMPLIFIER, DSO8
LM4819M/NOPB 0.35 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8
LM4854MM 0.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO10
LM4864LDX/NOPB 0.725 W, 1 CHANNEL, AUDIO AMPLIFIER, DSO10
LM4867MTEX/NOPB 3 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LM4810MM 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Dual 105mW Headphone Amplifier with Active-High Shutdown Mode
LM4810MM/NOPB 功能描述:音頻放大器 LM4810 Dual 105mW Headphone Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
LM4810MMX/NOPB 功能描述:音頻放大器 LM4810 Dual 105mW Headphone Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
LM4811 制造商:UTC-IC 制造商全稱:UTC-IC 功能描述:DUAL 105mW HEADPHONE AMPLIFIER WITH DIGITAL VOLUME CONTROL AND SHUTDOWN MODE
LM4811G-SM2-R 制造商:UTC-IC 制造商全稱:UTC-IC 功能描述:DUAL 105mW HEADPHONE AMPLIFIER WITH DIGITAL VOLUME CONTROL AND SHUTDOWN MODE
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*