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Rev 3.1
July. 2004
512Kx36 & 1Mx18 QDRTM II b4 SRAM
K7R163684B
K7R161884B
36 (or 18)
Q(Data Out)
(Echo Clock out)
CQ, CQ
72
512Kx36-bit, 1Mx18-bit QDRTM II b4 SRAM
FEATURES
FUNCTIONAL BLOCK DIAGRAM
1.8V+0.1V/-0.1V Power Supply.
DLL circuitry for wide output data valid window and future
freguency scaling.
I/O Supply Voltage 1.5V+0.1V/-0.1V for 1.5V I/O,
1.8V+0.1V/-0.1V for 1.8V I/O
.
Separate independent read and write data ports
with concurrent read and write operation
HSTL I/O
Full data coherency, providing most current data .
Synchronous pipeline read with self timed late write.
Registered address, control and data input/output.
DDR(Double Data Rate) Interface on read and write ports.
Fixed 4-bit burst for both read and write operation.
Clock-stop supports to reduce current.
Two input clocks(K and K) for accurate DDR timing at clock
rising edges only.
Two input clocks for output data(C and C) to minimize
clock-skew and flight-time mismatches.
Two echo clocks (CQ and CQ) to enhance output data
traceability.
Single address bus.
Byte write (x18, x36) function.
Sepatate read/write control pin(R and W)
Simple depth expansion with no data contention.
Programmable output impenance.
JTAG 1149.1 compatible test access port.
165FBGA(11x15 ball array FBGA) with body size of 13x15mm
R
ADDRESS
W
C
D(Data in)
ADD
REG
DATA
REG
CLK
GEN
CTRL
LOGIC
512Kx36
(1Mx18)
MEMORY
ARRAY
WRITE DRIVER
K
BWX
36 (or 18)
SELECT OUTPUT CONTROL
SEN
SE
A
M
PS
W
R
IT
E
/RE
AD
DE
C
O
D
E
OUT
P
UT
RE
G
OUT
P
UT
S
E
L
E
CT
OUT
P
UT
DRIV
E
R
Notes: 1. Numbers in ( ) are for x18 device
72
17
17 (or 18)
4 (or 2)
72(or 36)
144
Organization
Part
Number
Cycle
Time
Access
Time
Unit
X36
K7R163684B-FC30
3.3
0.45
ns
K7R163684B-FC25
4.0
0.45
ns
K7R163684B-FC20
5.0
0.45
ns
K7R163684B-FC16
6.0
0.50
ns
X18
K7R161884B-FC30
3.3
0.45
ns
K7R161884B-FC25
4.0
0.45
ns
K7R161884B-FC20
5.0
0.45
ns
K7R161884B-FC16
6.0
0.50
ns
QDR SRAM and Quad Data Rate comprise a new family of products developed by Cypress, Renesas, IDT, NEC and Samsung technology.
(or 18)
(or 36)
(or 72)