原裝無鉛原包手機ic內(nèi)存字庫芯片fbga封裝

類型 手機IC 品牌 m-systems
型號 md8832-d1g-x18-x-p 封裝 fbga
批號 japan0612kfd1xt9584


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   diskonchip g4 128mb (1gb)/256mb (2gb) 1.8v

 

    flash disk with mlc nand and m-systems’ x2 technology

 

                                                                                       data sheet, november 2005

 

highlights                                                small form factors:

                                    th                       69-ball fbga 9x12 mm package

diskonchip g4 is m-systems”” 4         generation of

the diskonchip family of products. based on               enhanced performance by implementation

multi-level cell (mlc) nand, utilizing                       of:

toshiba’s 90nm mlc nand large block                               dma support

flash technology and x2 technology from m-                        multiburst operation

systems, it is one of the industry’s most                 unrivaled data integrity with a robust error

efficient storage solutions. mlc nand flash                  detection code/error correction code

technology provides the smallest die size by                 (edc/ecc) tailored for mlc nand flash

storing 2 bits of information in a single memory             technology

cell. x2 technology enables mlc nand to                   maximized flash endurance with trueffs(r)

achieve highly reliable, high-performance data               6.3.2 (and higher)

and code storage with a specially designed error

                                                          support for major operating systems (oss),

detection and correction mechanism, optimized

                                                             including symbian os, microsoft windows

file management, and proprietary algorithms for

                                                             mobile, palm os, nucleus, linux, ose,

enhanced performance.

                                                             windows ce, and more.

further cost benefits derive from the

                                                          compatible with major cpus, including

cost-effective architecture of diskonchip g4,

                                                             ti omap, ti dbb, intel xscale, infinion,

which includes a boot block that can replace

                                                             egold and sgold, adi 652x,  freescale

expensive nor flash, and incorporates both the

                                                             mx, and qualcomm msmxxxx.

flash array and an embedded thin controller in a

single die.

 

diskonchip g4 provides:

 flash disk for both code and data storage

 low voltage: 1.8v core and i/o

 hardware protection and security-enabling

    features

 high capacity: single die - 1gb (128mb),

    dual die - 2gb (256mb)

 device cascade capacity: up to 4gb

    (512mb)

 enhanced programmable boot block

    enabling execute in place (xip)

    functionality using 16-bit interface

 

1                                        data sheet (preliminary) rev. 0.3                        92-ds-1105-00


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                                                                   diskonchip g4 128mb (1gb)/256mb (2gb) 1.8v

 

performance                                           boot capability

 multiburst read: 15 mb/sec                            2kb programmable boot block with xip

 sustained read: 9 mb/sec                                 capability to replace boot nor

 sustained write: 2.4 mb/sec                           download engine (de) for automatic

 access time:                                             download of boot code from programmable

    normal: 33 nsec                                       boot block

protection & security-enabling features                asynchronous boot mode to boot from

 16-byte unique identification (uid)                      arm-based cpus, e.g. xscale, ti omap,

                                                          freescale mx without the need for external

    number

                                                          glue logic

 16kbyte user-controlled one time

    programmable (otp) area                            virtual and paged ram boot modes.enable

                                                          booting from diskonchip under secure

 two configurable hardware-protected

                                                          boot platforms

    partitions for data and code:

         read-only mode                                exceptional boot performance with

         write-only mode                                  multiburst operation and dma support

         one-time write mode (rom-like)                   enhanced by external clock

            partition                                 hardware compatibility

         protection key and lock# signal

                                                       configurable interface: simple nor-like or

          sticky lock (slock) to lock boot

                                                          multiplexed address/data interface

            partition

         protected bad block table                     cpu compatibility, including:

                                                               arm-based cpus

reliability and data integrity                                 texas instruments omap, dbb

 hardware- and software-driven, on-the-fly                     intel xscale pxaxxx family

    edc and ecc algorithms                                     infinion xgold family

 4-bit error detection code/error correction                   analog devices (adi) ad652x

    code (edc/ecc), based on a patented                            family

    combination of bch and hamming code                        freescale mx family

    algorithms, tailored for mlc nand flash                    zoran er4525

    technology                                                 renesas sh mobile

 guaranteed data integrity after power                         qualcomm msmxxxx

    failure                                                    amd alchemy

                                                               motorola powerpc(tm) mpc8xx

 transparent bad-block management

                                                               hitachi superh(tm) sh-x

 dynamic and static wear-leveling

                                                       supports 8-, 16- and 32-bit architectures

 

2                                      data sheet (preliminary) rev. 0.3                     92-ds-1105-00


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                                                                   diskonchip g4 128mb (1gb)/256mb (2gb) 1.8v

 

         (r)

trueffs   software

                                                      power requirements

 full hard-disk read/write emulation for

                                                       operating voltage

    transparent file system management

                                                         core, i/o: 1.65 to 1.95v

 patented trueffs

                                                       current consumption

         flash file system management                         active mode:

         automatic block management                               read 4.2ma

         data management to maximize the

                                                                  program 7.4ma

            limit of typical flash life expectancy                erase 7.4ma

         dynamic virtual mapping

                                                              deep power-down mode:

 dynamic and static wear-leveling                                 10 μa (1gb/128mb)

 programming, duplicating, testing and                            20 μa (2gb/256mb)

    debugging tools available in source code          capacity and packaging

 

operating environment                                  128mb (1gb) capacity (single die):

 

 wide os support, including:                                  device cascading option for up to

          symbian os                                              four devices (4gb)

         microsoft windows mobile                             69-ball fbga package:

         palm os                                                  9x12x1.2 mm (width x length x

         nucleus                                                  height)

         windows ce                                           ballout compatible with

         linux                                                    diskonchip g3/p3, g3/p3 lp and

         ose                                                      h1 fbga products

         vxworks                                       256mb (2gb) capacity (dual die):

 trueffs software development kit (sdk)                       device cascading option for up to

    for quick and easy support for proprietary                    two devices (4gb)

    oss, or os-less environment                               69-ball fbga package:

 trueffs boot software development kit                            9x12x1.4 mm (width x length x

    (bdk)                                                         height)

                                                              ballout compatible with

                                                                  diskonchip g3/p3, g3/p3 lp, h1

                                                                  and, h3 fbga products

 

3                                     data sheet (preliminary) rev. 0.3                     92-ds-1105-00


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                                                                               diskonchip g4 128mb (1gb)/256mb (2gb) 1.8v

 

revision history