參數(shù)資料
型號： DS3120
廠商： Maxim Integrated Products
文件頁數(shù)： 101/133頁
文件大?。?/td> 0K
描述： IC FRAMER T1 28-CHAN 0-70C DEG
標準包裝： 1
控制器類型： T1 調幀器
接口： 并行/串行
電源電壓： 2.97 V ~ 3.63 V
電流 - 電源： 300mA
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 316-BGA
包裝： 管件
DS3112
7 of 133
1
DETAILED DESCRIPTION
The DS3112 TEMPE (T3 E3 MultiPlexEr) device can be used either as a multiplexer or a T3/E3 framer.
When the device is used as a multiplexer, it can be operated in one of three modes:
M13—Multiplex 28 T1 lines into a T3 data stream
E13—Multiplex 16 E1 lines into an E3 data stream
G.747—Multiplex 21 E1 lines into a T3 data stream
See Figure 1-1, Figure 1-2, and Figure 1-3 for block diagrams of these three modes. In each of the block
diagrams, the receive section is at the bottom and the transmit section is at the top. The receive path is
defined as incoming T3/E3 data and the transmit path is defined as outgoing T3/E3 data. When the device
is operated solely as a T3 or E3 framer, the multiplexer portion of the device is disabled and the raw
T3/E3 payload will be output at the FRD output and input at the FTD input. See Figure 1-1 and
Figure 1-2 for details.
In the receive path, raw T3/E3 data is clocked into the device (either in a bipolar or unipolar fashion) with
the HRCLK at the HRPOS and HRNEG inputs. The data is then framed by the T3/E3 framer and passed
through the two-step demultiplexing process to yield the resultant T1 and E1 data streams, which are
output at the LRCLK and LRDAT outputs. In the transmit path, the reverse occurs. The T1 and E1 data
streams are input to the device at the LTCLK and LTDAT inputs. The device will sample these inputs
and then multiplex the T1 and E1 data streams through a two-step multiplexing process to yield the
resultant T3 or E3 data stream. Then this data stream is passed through the T3/E3 formatter to have the
framing overhead added, and the final data stream to be transmitted is output at the HTPOS and HTNEG
outputs using the HTCLK output.
The DS3112 has been designed to meet all of the latest telecommunications standards. Section 1.1 lists all
of the applicable standards for the device.
The TEMPE device has a number of advanced features such as:
The ability to drop and insert up to two T1 or E1 ports
An on-board HDLC controller with 256-byte buffers
An on-board Bit Error Rate Tester (BERT)
Advanced diagnostics to create and detect many different types of errors
See Section 1.2 for a complete list of main features within the device.
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相關代理商/技術參數(shù)
參數(shù)描述
DS3120N 功能描述:IC FRAMER T1 28-CHANNEL IND RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
DS3121 功能描述:IC TGATOR T1-T3 AGGREGATOR RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
DS3121N 功能描述:IC TGATOR T1-T3 AGGREGATOR IND RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
DS31256 功能描述:輸入/輸出控制器接口集成電路 256Ch High Thruput HDLC Cntlr RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
DS31256+ 功能描述:輸入/輸出控制器接口集成電路 256Ch High Thruput HDLC Cntlr RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
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