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參數(shù)資料
| 型號： | CX77315 |
| 英文描述： | CX77315 Product Summary|PA Modules for GSM/GPRS Handsets |
| 中文描述： | CX77315產(chǎn)品概要|功率放大器模塊的GSM / GPRS手機(jī) |
| 文件頁數(shù)： | 8/14頁 |
| 文件大?。?/td> | 517K |
| 代理商： | CX77315 |
Data Sheet CX77301
PA Module for Dual-band EGSM900 DCS1800 / GPRS
8
SEPTEMBER 19, 2003
Skyworks Solutions, Inc. Proprietary Information
[781] 376-7000 FAX [781] 376-3100 SALES@SKYWORKSINC.COM
WWW.SKYWORKSINC.COM
100956E
0.86
1.42
5.00
PIN 1
PIN
16
3.20 9.8
1.905
12.3
STENCIL APERTURE
TOP VIEW
APPROACH 1
Component
Outline
Common Ground Pad
0.762
1.32
9.70
1.905 TYP
0.250
12.20
METALLIZATION
TOP VIEW
Thermal Via Array
o
Additional vias will improve
thermal performance.
NOTE: Thermal vias should be
tented and filled with solder mask,
30–35 μm Cu plating recommended.
SOL
DER MASK OPENING
TOP VIEW
12.3
7
4X 0.82
1.91 TYP
9.8
1.42
0.05 ALL AROUND
0.86
4.5
1.42
0.86
1.8
1
0.3
9.8
1.91
12.3
STENCIL APERTURE
TOP VIEW
APPROACH 2
Component
Outline
Component
Outline
Component
Outline
PIN 1
PIN
16
PIN 1
PIN
16
PIN 1
PIN
16
100956_014
Figure 4. Phone Board Layout Footprint for 9.1 mm x 11.6 mm Package
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