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參數(shù)資料
| 型號： | CX77140 |
| 英文描述： | CX77140: PAM for CDMA / AMPS (824–849 MHz)|PA Modules for CDMA Handsets |
| 中文描述： | CX77140：聚丙烯酰胺的CDMA / AMPS二元（824-849兆赫）| CDMA手機功率放大器模塊 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 246K |
| 代理商： | CX77140 |
Packaging and Handling Information
77129
System Smart PA Module for CDMA / AMPS (824–849 MHz)
14
Conexant
101384A
May 14, 2002
Packaging and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The CX77129 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Conexant, please refer to
Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752
. Additional information on standard SMT reflow profiles
can also be found in the
JEDEC Standard J–STD–020A
.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to
Application Note: Tape and Reel, Document Number 101568.
Figure 1. Typical Case Markings
101384_006
CONEXANT
CX77129-NN
EXXXXX.XX MEX
YYWW
Manufacturing Part Number-Revision Number
Mark Pin 1
Identifier
Lot Number Country Code
YY = Manufacture Year
WW = Week Package Sealed
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CX77141 | CX77141: Product Summary|PA Modules for WCDMA Handsets |
| CX77144 | CX77144 Product Summary|PA Modules for CDMA Handsets |
| CX77105 | CX77105: PAM Dual-mode for CDMA PCS (824-849 MHz)|PA Modules for CDMA Handsets |
| CX77106 | CX77106 Product Summary|PA Modules for CDMA Handsets |
| CX77107 | CX77107: PAM for CDMA / PCS (1850–1910 MHz)|PA Modules for CDMA Handsets |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CX77140-13 | 制造商:Skyworks Solutions Inc 功能描述:POWER AMP MODULE |
| CX77141 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77141: Product Summary|PA Modules for WCDMA Handsets |
| CX77144 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77144 Product Summary|PA Modules for CDMA Handsets |
| CX77301 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77301: PAM for Dual-Band EGSM / GPRS|PA Modules for GSM/GPRS Handsets |
| CX77302-11P | 制造商:Conexant Systems Inc 功能描述:IC, POWER AMPLIFIER FOR SONY ERICSSON, QFN |
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