參數(shù)資料
型號(hào): AMMP-6345-TR2G
元件分類(lèi): 放大器
英文描述: 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: 5 X 5 MM, 2 MM HEIGHT, SURFACE MOUNT PACKAGE-8
文件頁(yè)數(shù): 10/10頁(yè)
文件大?。?/td> 685K
代理商: AMMP-6345-TR2G
9
.0100 [0.25]
.0180 [0.46]
.0110 [0.28]
0.114 [2.89]
.0160 [0.41]
.00095 [0.24]
.0160 [0.41]
.0120 [0.3]
.0095 [0.24]
.0935 [2.37]
.0180 [0.46]
.1260 [3.2]
.0590 [1.5]
.0200 [0.51]
1.04
2.49
0.72
0.36
0.15
2.79
0.25
0.55
0.39
0.3
0.1
0.52
0.77
1.47
0.56
0.38
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 19. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath.
Figure 18. Recommended PCB Material and Land Pattern. Dimensions in
inches [mm]. Material is rogers RO4350, 0.010”thick
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across the
I/O pads. Considering the fact that solder paste thickness
will directly affect the quality of the solder joint, a good
choice is to use a laser cut stencil composed of 0.127mm
(5 mils) thick stainless steel which is capable of producing
the required fine stencil outline.
The combine PCB and stencil layout is shown in Figure20.
Figure 19. Stencil Outline Drawing (mm)
Figure 20. Combined PCB and Stencil Layouts
相關(guān)PDF資料
PDF描述
AMMP-6420 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6522-TR1G 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6522-TR2G 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6545-BLKG 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
AMMP-6545-TR1G 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
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