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參數資料
| 型號： | AMMP-6345-BLKG |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, 2 MM HEIGHT, SURFACE MOUNT PACKAGE-8 |
| 文件頁數： | 10/10頁 |
| 文件大小： | 685K |
| 代理商： | AMMP-6345-BLKG |
9
.0100 [0.25]
.0180 [0.46]
.0110 [0.28]
0.114 [2.89]
.0160 [0.41]
.00095 [0.24]
.0160 [0.41]
.0120 [0.3]
.0095 [0.24]
.0935 [2.37]
.0180 [0.46]
.1260 [3.2]
.0590 [1.5]
.0200 [0.51]
1.04
2.49
0.72
0.36
0.15
2.79
0.25
0.55
0.39
0.3
0.1
0.52
0.77
1.47
0.56
0.38
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 19. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath.
Figure 18. Recommended PCB Material and Land Pattern. Dimensions in
inches [mm]. Material is rogers RO4350, 0.010”thick
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across the
I/O pads. Considering the fact that solder paste thickness
will directly affect the quality of the solder joint, a good
choice is to use a laser cut stencil composed of 0.127mm
(5 mils) thick stainless steel which is capable of producing
the required fine stencil outline.
The combine PCB and stencil layout is shown in Figure20.
Figure 19. Stencil Outline Drawing (mm)
Figure 20. Combined PCB and Stencil Layouts
相關PDF資料 |
PDF描述 |
|---|---|
| AMMP-6345-TR1G | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6345-TR2G | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6420 | 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6522-TR1G | 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6522-TR2G | 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關代理商/技術參數 |
參數描述 |
|---|---|
| AMMP-6408 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 to 18 GHz 1 W Power Amplifier in SMT Package |
| AMMP-6408_08 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 to 18 GHz 1 W Power Amplifier in SMT Package |
| AMMP-6408-BLKG | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數:0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6408-TR1G | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數:0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6408-TR2G | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數:0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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