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參數(shù)資料
| 型號： | ADV3220ACPZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER 2:1 16LFCSP |
| 標準包裝： | 1 |
| 功能： | 多路復(fù)用器 |
| 電路： | 1 x 2:1 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±5V |
| 電流 - 電源： | 7.5mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 8-LFCSP-WD（3x3） |
| 包裝： | 托盤 |
ADV3219/ADV3220
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 3.
Parameter
Rating
Supply Voltage (V+ V)
12 V
Analog Input Voltage
V to V+
Digital Input Voltage
0 to V+
Output Voltage (Disabled Output)
(V+ 1 V) to (V + 1 V)
Output Short-Circuit
Duration
Momentary
Current
50 mA
Temperature
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
The ADV3219/ADV3220 are operated with ±5 V supplies and
can drive loads down to 150 Ω, resulting in a wide range of
possible power dissipations. For this reason, extra care must
be taken derating the operating conditions based on ambient
temperature.
Packaged in an 8-lead LFCSP, the ADV3219 and ADV3220
junction-to-ambient thermal impedance (θJA) is 85°C/W. For long-
term reliability, the maximum allowed junction temperature of the
die, TJ, should not exceed 125°C. Temporarily exceeding this
limit can cause a shift in parametric performance due to a change
in stresses exerted on the die by the package. Figure 2 shows the
range of the allowed internal die power dissipations that meet
these conditions over the 40°C to +85°C ambient temperature
range. When using Figure 2, do not include the external load
power in the maximum power calculation, but do include the
load current through the die output transistors.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.5
0.3
0.6
0.9
1.2
15
25
35
45
55
65
75
85
MA
XI
MU
M
P
O
W
E
R
(W
)
AMBIENT TEMPERATURE (°C)
TJ = 125°C
08
64
9-
0
02
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead LFCSP
85
23
°C/W
Figure 2. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION
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