參數(shù)資料
型號(hào): ADG4612BRUZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 2/24頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH QUAD SPST 16TSSOP
設(shè)計(jì)資源: Power off protected data acquisition signal chain using ADG4612 , AD711, and AD7476 (CN0165)
標(biāo)準(zhǔn)包裝: 96
功能: 開(kāi)關(guān)
電路: 4 x SPST - NO
導(dǎo)通狀態(tài)電阻: 5.1 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 3 V ~ 12 V,±3 V ~ 5.5 V
電流 - 電源: 600µA
工作溫度: -40°C ~ 105°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 管件
ADG4612/ADG4613
Rev. 0 | Page 10 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
TOP VIEW
(Not to Scale)
1
2
3
4
5
6
7
8
ADG4612/
ADG4613
NC = NO CONNECT
16
15
14
13
12
11
10
9
D1
S1
VSS
D4
S4
GND
IN1
D2
S2
VDD
D3
IN4
IN3
S3
NC
IN2
090
05
-00
2
Figure 2. TSSOP Pin Configuration
PIN 1
INDICATOR
NOTES
1. EXPOSED PAD TIED TO SUBSTRATE, GND.
2. NC = NO CONNECT.
1
S1
2
VSS
3
GND
4
S4
11 VDD
12 S2
10 NC
9S3
5
D
4
6
IN
4
7
IN
3
8
D
3
1
5
IN
1
6
D
1
4
IN
2
1
3
D
2
TOP VIEW
(Not to Scale)
ADG4612/
ADG4613
09
00
5-
00
3
Figure 3. LFCSP Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
TSSOP
LFCSP
Mnemonic
Description
1
15
IN1
Logic Control Input 1. This pin has an internal 400 kΩ pull-down resistor to GND.
2
16
D1
Drain Terminal 1. Can be an input or output.
3
1
S1
Source Terminal 1. Can be an input or output.
4
2
VSS
Most Negative Power Supply Potential.
5
3
GND
Ground (0 V) Reference.
6
4
S4
Source Terminal 4. Can be an input or output.
7
5
D4
Drain Terminal 4. Can be an input or output.
8
6
IN4
Logic Control Input 4. This pin has an internal 400 kΩ pull-down resistor to GND.
9
7
IN3
Logic Control Input 3. This pin has an internal 400 kΩ pull-down resistor to GND.
10
8
D3
Drain Terminal 3. Can be an input or output.
11
9
S3
Source Terminal 3. Can be an input or output.
12
10
NC
No Connection.
13
11
VDD
Most Positive Power Supply Potential.
14
12
S2
Source Terminal 2. Can be an input or output.
15
13
D2
Drain Terminal 2. Can be an input or output.
16
14
IN2
Logic Control Input 2. This pin has an internal 400 kΩ pull-down resistor to GND.
N/A
0
EPAD
The exposed pad is connected to the substrate GND. For best heat dissipation, it is
recommended that this pad be connected to GND. If heat dissipation is not a concern,
it is possible to leave the pad floating. Connecting the exposed pad to VSS (if VSS is not
equal to GND) can cause current to flow and can damage the part.
Table 9. ADG4612 Truth Table
ADG4612 INx
Switch Condition
1
On
0
Off
Table 10. ADG4613 Truth Table
ADG4613 INx
S1, S4
S2, S3
0
Off
On
1
On
Off
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